Teledyne e2v Launches Breakthrough 8 GB DDR4 Memory Chip for Space Applications - Technology

Teledyne e2v Qualifies Space - Ready 8 GB DDR4 Memory Chip

Teledyne e2v recently announced the successful space qualification of its 8 GB DDR4 memory chip in Paris , France on July 17 , 2024 . This achievement expands the company 's edge compute solutions for space applications . The qualification process included various activities such as temperature cycling , construction analysis , C - SAM , preconditioning , Temperature Humidity Bias , and radiation testing.

The demand for compact , high - density memory solutions is on the rise , and Teledyne e2v highlights that its latest memory chip is compatible with modern high - end space processing components . These components include processors from AMD / Xilinx VERSAL ACAP , space FPGAs , MPSOCs , Microchip RT PolarFire , and various proprietary ASICs . The 8 GB DDR4 memory chip offers ultra - fast , high - density storage in the same form factor and pin compatibility as the smaller 4 GB DDR4 option , making it ideal for next - generation designs.

 Thomas Guillemain , Marketing and Business Development Manager for Data Processing Products at Teledyne e2v , emphasized the importance of fast memory in modern data - intensive satellites . The new 8 GB part doubles storage density in a compact form factor compared to the previous 4 GB option . Teledyne e2v offers a diverse , ruggedized , and versatile space - grade portfolio with multiple temperature grades and qualification variants up to NASA level 1.

The new memory chip supports a transfer rate of 2400 MT / s and is immune to single - event latch - up ( SEL ) up to 60 MeV.cm2 / mg . It can withstand a total ionizing dose ( TID ) of 100 krad and has SEU data up to 60 MeV.cm/mg . Physically , the 8 GB device is available in a package form factor identical to the previous 4 GB version ( 15 mm x 20 mm x 1.92 mm ) , effectively doubling storage density while maintaining pinout compatibility.

In conclusion , the successful qualification of the Teledyne e2v 8 GB DDR4 memory chip represents a significant advancement in semiconductor memory technology for space applications . The increased storage density , compatibility with modern space processing components , and resistance to radiation make it an ideal choice for the next generation of data - intensive satellites and space missions.